Thermal faults can be caused by cracked solder joints, degraded semiconductors, capacitors, connectors or components whose parameters drift with temperature. The goal is to reproduce the symptom in a controlled way.
Document when the fault occurs
Record warm-up time, load, ambient conditions and the exact symptom. Repeatability is essential before trying to localize the cause.
Compare temperatures
Thermal imaging or appropriate temperature measurements can reveal unexpected hot spots and components that change behavior near the moment of failure.
Change temperature selectively
Controlled heating or cooling of small areas can help identify a temperature-sensitive section. Avoid condensation, thermal shock and temperatures outside component ratings.
Measure before and during the fault
Compare rail voltages, current draw and signals in the working and failed states. The difference often provides a clearer clue than temperature alone.
Record fault conditions and measurements together.
BoardIQ helps keep changing measurements and diagnostic observations organized during difficult repairs.
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